3.13.3 Practice Questions TestOut Pc Pro
Correct answer: CPU, thermal paste, heat sink, fan Explanation The following is the correct order for applying devices to cool a processor: CPU Thermal paste Heat sink Fan
What is the correct order for installing a processor for proper cooling? Answer Thermal paste, CPU, heat sink, fan Heat sink, CPU, thermal paste, fan CPU, thermal paste, heat sink, fan CPU, heat sink, thermal paste, fan
Correct answer: Between the heat sink and CPU Explanation Thermal paste or a thermal pad is found between the heat sink and the CPU. The thermal paste helps to make a good contact between the CPU and the heat sink so that heat can move between the two. Processors require some form of heat dissipation system to function properly. Without a heat dissipation system, a processor will overheat and burn out in less than a minute. Most modern CPUs require a heat sink and a fan.
Where should you apply the thermal paste when installing a processor? AnswerCorrect Answer: Between the heat sink and CPU Between the motherboard and CPU Between the CPU and fan Between the heat sink and fan
Correct answer: More reliable than active heat sinks Explanation Passive heat sinks do not have a fan and instead rely on increased surface area and passive air movement to cool the component. Because they do not use a fan, passive heat sinks are 100% reliable. Passive heat sinks are used with the following components: Most motherboard chipsets Low-end video cards Memory modules (heat sinks on memory modules are also called heat spreaders) Active heat sinks use a fan and are able to cool components much faster and more efficiently than passive heat sinks. Liquid-based cooling systems use cooling plates and thermal liquid to dissipate heat from components.
Which of the following characteristics accurately describes passive heat sinks? Answer More efficient than active heat sinks Used on high-end video cards More reliable than active heat sinks Used by liquid-based cooling systems
Correct answer: Throttling Explanation Throttling modifies the operating characteristics of a processor based on current conditions. Overclocking is a feature offered on special motherboards that causes the processor to operate at a higher speed. A multi-core processor has multiple processor cores integrated into a single processor package. Hyper-threading is a feature of some Intel processors that allows the CPU to process threads in parallel. Caching, when used to describe processors, is a temporary storage area for data that is waiting for the processor.
Which of the following processor features is MOST likely to significantly reduce power consumption based on current operating conditions? Answer Caching Multi-core Throttling Hyper-threading Overclocking
Correct answer: Passive heat sink Explanation Memory modules use passive heat sinks (also called heat spreaders). They do not have a fan because they rely on increased surface area and passive air movement to cool them. Active heat sinks are used by components that generate more heat, such as CPUs, high-end video cards, and some motherboard chipsets with integrated graphics. Surface area dissipation is a generic term for cooling used by both active and passive cooling systems. Liquid cooling systems are used when air cooling is not sufficient. Liquid-based cooling systems are composed of tubes, cooling plates, a reservoir, and a radiator; they are primarily used for high-end gaming computers and high-performance systems.
Which of the following thermal solutions might you find on memory modules? Answer Liquid cooling Surface area dissipation Active heat sink Passive heat sink
Correct answer: Overheated processor Explanation An overheated processor is the most likely cause of random system lockups. A loose monitor cable will only affect the display and cause the image to cut out or distort. A faulty mouse or keyboard only causes problems with user input. A failing network adapter will cause networking issues, such as internet connection loss, but the system will still be able to run.
A computer was brought into your help desk center for repair. You have been told that it randomly locks up. Which of the following is MOST likely causing this issue? Answer Overheated processor Loose monitor cable Faulty mouse or keyboard Failing network adapter
Used for cooling high-end video cards Active heat sink Used for cooling high-end gaming computers Liquid cooling Has a fan attached to the heat sink Active heat sink Used for cooling CPUs Active heat sink Exhausts hot air out of the back of the case Power supply Used for cooling memory modules Passive heat sink Used for cooling high-performance systems Liquid cooling Has no fan attached to the heat sink Passive heat sink Explanation Active heat sinks have an attached fan that helps cool off the component at a faster rate. Active heat sinks are used with the following components: CPUs High-end video cards Passive heat sinks do not have a fan and instead rely on increased surface area and passive air movement to cool the component. Passive heat sinks are used with the following components: Low-end video cards Memory modules ATX power supplies aid in cooling by exhausting hot air out the back of the case. Liquid cooling systems are used when air cooling is not sufficient. Because liquid cooling can dissipate heat much faster than air cooling, it is primarily used for high-end gaming computers and high-performance systems. Case fans create a pressurized system that allows air to flow through the case in a specific way.
Match the cooling system types on the left with the appropriate characteristics and uses on the right. Each cooling system type can be used once, more than once, or not at all. Used for cooling high-end video cards Used for cooling high-end gaming computers Has a fan attached to the heat sink Used for cooling CPUs Exhausts hot air out of the back of the case Used for cooling memory modules Used for cooling high-performance systems Has no fan attached to the heat sink Answers Passive heat sink Active heat sink Power supply Liquid cooling
Correct answer: Keep the ambient temperature below 80 degrees F. Correct answer: Bundle cables together and secure unused cables to the case. Correct answer: Leave space between the case and any walls or obstructions Consider the following recommendations to ensure optimal system cooling: Keep the case free of dust and debris. Excess dust can restrict airflow and prevent proper heat transfer. Reduce the number of airflow obstructions. Employ proper cable management (bundle cables together and secure unused cables to the case). Space out multiple hard disk drives instead of stacking them next to each other. Maintain appropriate ambient temperatures. Optimal ambient temperatures are between 60 and 80 degrees Fahrenheit. Ensure proper ventilation; leave space between the computer and any walls or desks. Preserve negative pressure inside the case by keeping all covers and shields installed (unused expansion cards, I/O shield, front drive bays).
Which of the following will ensure optimal system cooling? (Select three.) Keep the ambient temperature below 80 degrees F. Remove unused expansion slot covers to increase air flow. Bundle cables together and secure unused cables to the case. Remove the side panel on the case. Leave space between the case and any walls or obstructions. Stack hard drives next to each other.
Correct answer: Removing the case side panel. Explanation Removing the case side panel will not keep a system from overheating. The system case is specially designed to maximize air flow across system components. By removing the side panel, you modify the air flow path and reduce its effectiveness. In addition, removing the side panel allows more dust to accumulate. Dust acts as an insulator and traps heat close to components. Cleaning off the inside of the computer case, installing heat spreaders and heat sinks on internal components, installing a water cooling system, and adding thermal paste or a thermal pad between the CPU and the heat sink are all good ways to help keep a system cool.
You have a system that has been overheating. Which of the following actions will NOT help to keep the system cool? Answer Installing heat spreaders and heat sinks on internal components. Cleaning off the inside of the computer case. Removing the case side panel. Adding thermal paste or a thermal pad between the CPU and the heat sink. Installing a water cooling system.
Correct answer: Make sure the heat sink is properly mounted and has thermal paste. Correct answer: Check the CPU fan power.
You have just finished upgrading the CPU in your desktop system. After running the system for about 10 minutes, the system locks up and automatically restarts. Which of the following is the BEST first steps in troubleshooting the problem? (Select two.) Answer Make sure the heat sink is properly mounted and has thermal paste. Replace the power supply. Check the CPU fan power. Check the power supply voltage switch. Remove any unneeded components and run the system.
