Manufacturing quizzes T2

¡Supera tus tareas y exámenes ahora con Quizwiz!

the from fibers to finished composite video shows how to make composite material. which kind of reinforcement is used? a. 1 D b. 2D c. isotropic

2D

a. removing photosresist, gernerating patterns by steppers, depositing photoresist b. gernerating patterns by steppers, removing photoresist, depositing photoresist c.depositing photoresist, gernerating patterns by steppers, removing photoresist d.depositing photoresist, removing photoresist gernerating patterns by steppers,

.depositing photoresist, gernerating patterns by steppers, removing photoresist

Which deposition method has higher depositing temp? a CVD (Chemical Vapor Deposition) b. PVD (Physical Vapor Deposition)

CVD

_____________is used for coated carbides while _________________ is used for coated HSS. A. PVD/CPD. B. CVD/PVD.

CVD/PVD

Both USM and RUM can machine circular holes and cavities a. true b. false

true

both usm and RUM are mechanical NTM non-traditional processes a. true b. false

true

in USM and RUM, the tool vibrates at a very high frequency a. true b. false

true

in USM, an abrasive slurry is used while in RUM a fix-abrasive tool is used a. true b. false

true

in ultrasonic machinging, either the tool or the workpiece virates at high frequency a. true b. false

true

some shapes can't be made with filament winding. a. true b. false

true

the NASA composet intro video shows taht a tree is a composite material. a. true b. false

true

warped wafer will be generated from both ID saw and wire saw. a. true b. false

true

when the applied load is below the endurance strength, the material will never fail regardless of the number of loading cycles a. true b. false

true

the purpose of truing and dressing is to prepare the grinding wheel to have correct form, concentricity and cutting action. Which one of the following is NOT true? a. some abrasive grains should be removed fromt he wheel during truing/dressing b. truing/dressing can be only done by using a multi-point diamond tool

truing/dressing can be only done by using a multi-point diamond tool

the purpose of truing and dressing is to prepare the grinding wheel to have correct form, concentriccity and cutting action. what is NOT true? a. truing/dressing is sometimes called balancing b. some abrasive grains should be removed from the wheel during truing/dressing c. truing/dressing can be done by using a single-oint diamond tool or a multi-point diamond tool

truing/dressing is sometimes called balancing

curing is the drying and hardening (or polymerization) of the resin matrix of a finished composite. this may be done --- by applying heat and /or pressure a. unaided b. aided c. unaided or aided

unaided or aided

which one of the ofllowing is NOT amon the limitations of EDM? a. low material removal rate b. long lead time c. workpiece material must be conductive d. can cut only one hole at a time

can cut only one hole at a time

IC and PCB are two terms that --- be used interchangeably a.can b. cannot

cannot

a composite material is composed of two or more materials. the individual components ---attain all the properties oft he composite materials a. cannot b. can

cannot

there are four "families" of materials processing processes a. casting, material removal, deformation, and consolidation b. turning, milling, boring, and grinding c. casting, grinding, welding,a nd forming d. sand casting, laser machining, water jet machining, ultrasonic machining

casting, material removal, deformation, and consolidation

which one of the fibers has high temp resistance? a. glass b. carbon c. boron d. ceramic e. metallic

ceramic

--- is used to obtain a flat surface a. deposition b. plasma etching c. photolithography d. chemical-mechanical polishing

chamical-mechanical polishing

even if we have a process that is in control, which causes of variations will still exist int he process? a. assignable causes b. chance causes c. none of the two d. both of them

chance causes

which one of the following processes is like a "corrosion process" a. chemical machining b. electrochemical machining c. abrasive flow machining d. ultrasonic machining

chemical machining

generally speaking, which one of the following areas has the largest composite consumption? a. space and defense b. commercial aerospace c. industrial d. electronic

commercial aerospace

what materials are used to maufacture the cutting tools for end mills? a. steels b. carbides (tungsten carbides) c. both a and b

both a and b

which one of the following is true for double disk grinding? a. both sides of a grinding wheel are grinding the workpiece b. both sides of a workpiece are being ground at the same time

both sides of the workpiece are being ground at the same time

Up milling and down milling refer to ---- a. slab milling only b. face milling only c. both slab and face milling

both slab and face milling

The heating and cooling cycle of a welding process can affect the metallurgical and quality of ______ a. . both the weld and adjacent material. B. only the weld. C. only the adjacent material

both the weld and adjacent material.

four primary grinding types are cylindrical, internal, centerlesss and surface grinding. Whis is true? a. both wheel and workpiece rotates b. wheel rotates and workpiece does not rotate c. workpiece rotates and wheel does not rotate

both wheel and workpiece rotate

which one of the following belongs to copper-zinc alloys?? a. steels b. both steels and cast iron c. brasses d. bronzes e. both brasses and bronzes

brasses

in autoclave molding process, the pressure --- reduce time a. can b. cannot

can

in composite manufacturing, which one of the following processes belongs to closed-mold processes? a. autoclave molding b. pressure-bag molding c. vacumm-bag molding d. filament winding e. compression molding

compression molding

Ductile materials tend to result in ____________ chips a. continuous b. discontinuous

continuous

the mold is --- in thermoplastic injectioin molding a. cooled b. heated c. cooled or heated

cooled

The first, and most critical step in the manufacturing of silicon wafers is ______. A. wafer slicing. B. wafer polishing. C. crystal growth. D. epitaxial deposition. E. wafer polishing.

crystal growth

which one of the following processes belongs to molding processes? a. imprenation b. curing c. extraction d. trimming

curing

abrasive machining is a mixture of ---- a. cutting and plowing b. plowing and rubbing c. cutting and rubbing d. cutting, plowing and rubbing

cutting, plowing and rubbing

whcih one is not the purposed of ingot shaping process? a. decrease the surface roughness of ingot surface b. obtain the uniform ingot shape c. gernerate flats to identify the front and back surfaces

dcrease the surface roughness of ingot surfaces

Increasing rake angle typically will _________ cutting force a. increase 'b. decrease

decrease

The total cost per unit for a machining process will ____________ as cutting speed increases A. decrease B. increase C. decrease to a point and then increase

decrease to a point and then increase

As shear angle increases the chip thickness --- 1. increases 2. decreases

decreases

which one of the following is NOT true regarding creep feed grinding? a. depth of cut is much smaller b. the feed rate is much smaller c. it requires much more horsepower

depth of cut is much smaller

generally, speaking, which one of the following casting processes has the highest production rates? a. sand casting b. invest casting c. die casting

die casting

which one of the following casting processes doesn't need patterns a. sand csting b. investment casting c. die casting

die casting

for a standard twist drill, the rake angle along the main cutting edges (lips) is --- a. different at different point b. same everywhere

different at different points

in spray-up process, --- fibers and resins are sprayed simultaneously into or onto the mold a. continuous b. discontinuous c. both

discontinuous

LBM --- generate cutting forces a. does b. does NOT

does NOT

to fabricate integrated circuits three types of materials are needed: conductors, insulators, and semiconductors. which is a conductor? a. doped polysilicon b. silicon dioxide c. silion

doped polysilicon

which one of the following orders represents the surface roughness order (from roughest to smoothest) ? a. honing>reaming>drilling b. reaming>drilling>honing c.drilling>reaming>honing d.drilling>honing>reaming

drilling>reaming>honing

generally speaking, turning can --- the wheel a. sharpen b. dull

dull

the electrode use din arc welding is --- a. always consumable b. always non-consumable c. either consumable or non-consumable

either consumable or non-consumable

what is the final step in making the ICs according to the video? a. chemical mechanical polishing b. doping c. electrical testing and packaging

electrical testing and packagine

which one of the following processes is the reverse of electroplating? a. chemical machining b. electrochemical machining c. abrasive flow machining d. ultrasonic machining

electrochemical machining

Pockets can be machined by --- milling a. slab b. face c. end

end

in a milling operation, if the surface generated is perpendicular to the cutter rotation axis, it is called--- milling a. slab b. face

face

Grinding operation is widely used in automotive industry, but has no applications in semiconductor industry a. true b. false

false

both USM and RUM can machine non circular holes and cavities a. true b. false

false

which one of the following processes involves separating each good die from the wafer? a. wafer sort testing b. final assembly c. packaging

final assembly

grain size, bond type and pore size all affect the wheel performance. t=which one of the following is not true? a.finer grain size produces rougher surface b. vitrified bond system is more rigid and more brittle than resin bond system c. pore space determines if the wheel has an "open" structure or "closed" structure

finer grain size produces rougher surface

BUE (built-up edge) is undesirable for ________ cutting but sometimes is desirable for ______ cutting. a. rough/finish b. finish/rough

finish/rough

LBM (laser beam machining) and AWM (abrasive waterjet machining) are primarily used to cut ---. a. flat sheets b. cylindrical parts c. hollow cavities

flat sheets

LBM laser beam machinining is used a. for cutting small holes b. for cutting large holes c. for cutting both

for cutting both

the completed chips are loaded on buringin boards and then put into ovens. the chips will be stressed far beyond normal conditions. the purpose of doing so is to --- a. strain harden the chips so they will have higher strenght b. force the weak chips to fail prematurely before they are put into products.

force the weak chips to fail prematurely before they are put into products

which one of the following processes does not gerneate HAZ? a. LBM laser beam machining b. oxygen fuel cutting c. PAC plasma arc cutting d. AWM abrasive waterjet machining

AWM

in a turning operation, if the initial diameter minus the final diameter equals 8 mm, what is the depth of cut? a. 1 mm b. 2 mm c. 4mm d. 8 mm

4 mm

superabrasives include CBN and diamond. ---- wheels are used to grind ferrous metals; the other wheels are used to grind non-ferrous metals and nonmetals a. CBN b. diamond

CBN

will increasing the feedrate improve the surface quality? a. yes b. no

no

Which one represents the correct order (from hardest to softest) of hardness for tool materials? A. Diamond > HSS > Carbides > Ceramics > CBN. B. Diamond > CBN > Ceramics >Carbides > HSS. C. Diamond > HSS > CBN > Carbides > Ceramics.

Diamond > CBN > Ceramics >Carbides > HSS

comparing to silicon, (GaAs) has several advantages as the semiconductor material for ICS. what is true? a. GaAs can provide faster speed b. GaAs is more abundant in the earth c. GaAs is cheaper than silicon d. the manufacturing of GaAs chips is less complex than solicon chips

GaAs can provide faster speed

For tool materials, Powder metallurgy technique can be used to fabricate ________. A. HSS, but not carbides and ceramics. B. HSS and carbides but not ceramics. C. HSS, carbides and ceramics D. carbides and ceramics but not HSS.

HSS, carbides and ceramics

Hot working can improve the mechanical properties. Which one is NOT the reason for the improvement? a.The starting structure is replaced with one of fine, spherical-shaped grains. b.Homogenous (uniform) metallurgical structure is obtained. c.The product exhibits a yfiber structurey and impurities can often be reoriented into a ycrack-arrestory configuration.

Homogenous (uniform) metallurgical structure is obtained

Which type of saws produce only single wafers at a time? A. ID saws. B. wire saws. C. none of these two saws.

ID saws

gernerally speaking, which one of the following processes gernerates the most accurate tolerance? a. LBM laser beam machining b. oxygen fuel cutting c. PAC plasma arc cutting d. AWM abrasive waterjet machining

LBM

for surface roughness measurements, in most cases, --- is used as the roughness value a. Rmax b. Ra c. Rmin d. RMS

Ra

Silicon wafers are sliced from the ingot using____________. A. ID saws only. B. wire saws only. C. none of these two saws. D. both ID and Wire saws.

both ID and Wire saws.

Which one of the following is NOT true regarding strain hardening? A. Strain hardening is eliminated in hot working. B. The degree of strain-hardening is different for different metals (Metals with a smaller strain-hardening coefficient n will have smaller change in strength with plastic deformation). C. Strain hardening will NOT increase the forces and power required for cold working.

Strain hardening will NOT increase the forces and power required for cold working.

For fusion welding, the center of the weld is a region called fusion zone. Which one of the following is NOT true regarding to this fusion zone? A. The microstructure depends on the cooling rate in the weld. B. This region cannot be expected to have the same properties as those of the base material being welded. C. The chemical composition of this region depends on the base metal and filler material. D. The grain structure in this region is always coarse.

The grain structure in this region is always coarse.

In regard to ECM (electrochemical machining), which one of the following is NOT true? A. ECM is basically the reverse of electroplating. B. Both tool and workpiece must be electrically conductive. C. The harder the workpiece material, the slower the metal removal rate. D. There is no wear of the tool during actual cutting as the tool is protected cathodically. E. The process produces a stress-free surface. .

The harder the workpiece material, the slower the metal removal rate.

Which one of the following is NOT among the benefits of elevated temperatures in hot working? A. The effects of strain hardening is eliminated. B. The metallurgical structure will always be uniform. C. They reduce the requirement of excessively high forces. D. They promote diffusion that can remove or reduce chemical inhomogeneities. .

The metallurgical structure will always be uniform

Which one of the following does not belong to the family of deformation processes? a. forging b. extrusion c. drawing d. boring

boring

for a given uncut chip thickness in orthogonal cutting, a smaller shear angle means----. a. a longer shear plane and a lower cutting force b. a shorter shear plane and a lower cutting force c. a shorter shear plane and a higher cutting force d. a longer shear plane and a higher cutting force

a longer shear plane and a higher cutting force

in wire-EDM, ---- a. a moving wire is used as the tool b. wire products are produced

a moving wire is used as the tool

in lapping processes, the material of lapping plate is --- than the wafer material

a. harder b. softer

the instrument panels (made of metals) are cut by what process? a. twist drilling b. end milling c. laser cutting d. abrasive water jet cutting

abrasive water jet cutting

According tot the video, when the cutting lfuid is appled into cuttin zone, many things will happen.What wont happen? a. the shear angle increases b. cutting temp decreases c. BUE disappears d. power consumption decreases e. actual clearance angle decreases

actual clearance angle decreases

which one of the following statemenst are NOT true? a.1-D reinforcement gives max trength in one direction b. 2-D reinforcement gives max trength in two direction c.isotropic strength equally in all directions d. isotropic strength differently in all directions

all directions

Which one of the following abrasives is the most widely used artificial abrasive? a.. Silicon carbide. B. Aluminum oxide. C. Cubic boron nitride

aluminum oxide

die casting can typically prodcue parts with --- dimensional precision and surface qualities than sand casting a. worse b. better

better

punching operation a. piercing b. blanking

blanking

you are at SEMICON west where companies exhibit their products. you are interested in buying a CMP machine for your companuy. Where should you look for CMP machines? a. front end processes b. back end processes

front end processes

resistance welding is in the group of a. fusion welding b. solid-state weldin

fusion welding

which one of the following welding processes involves melting the base metal a. fusion welding b. solid-state welding

fusion welding

in a MOS transistor, which one of the following controls the current flow? a. source b. gate c. drain

gate

which one of the fibers has the lowest cost and the most widely used? a. glass b. carbon c. boron d. ceramic e. metallic

glass

between lapping and grinding, which one has higher MRR? a. lapping b. grinding

grinding

between lapping and grinding, which one uses fixed abrasives? a. lapping b. grinding

grinding

in buring oven, the chips will be powered up to expose high temp for several hours. the purpose of doing so is to --- a. encourage potential defects to occur faste b. heal (fix) the defects in these chips

healf the defects in these chip

The magnitude of the shear angle is of fundamental importance. For any given uncut chip thickness, a small shear angle means a --- cutting force 1. high 2. low

high

the movie shows maufacturing of the grinding wheels. in making these wheels, the processes are --- a. very labor-intensive b. highly automated

highly automated

in composite manufacturing, which one of the following processes does not belong to molding operation? a. lay-up b. curing c. imprenation

imprenation

Generally speaking, lapping will _______ the wafer flatness. a. improve b. deteriorate

improve

When the depth of cut increases, the cutting force will typically --- 1. increase 2. decrease

increase

gernally speaking, a decrease in cutting speed will --- the tool life a. increase b. decrease

increase

if more dopant is added to silicon, then the conductivity of silicon will --- a. increase b.decrease c. staty the same

increase

In EDM, as the on-time increases, the overcut --- a. increases b. decreases

increases

generally speaking, as tensile strength increases, hardness --- a. increases b. decreases

increases

which one of the following processes useds the close-mold? a.vacuum bag molding b. pressure-bag molding c pultrusion d. manual lay-up e. injection molding

injection molding

when machining very hard materials such as hardened metals and ceramics, grinding operation --- preferable to turning and milling a. is b. is NOT

is

milling operations are used to machine flutes (or groves) in the blanks of the cutting tools. Is it appropriate to use milling to machine the flute for the cutting tools made of tungsten carbides? a. yes b. no

no

Which one of the following statements is NOT true regarding a honing operation? a. the tool used is a stone made by bonded abrasives b. it removes a small amount of material from the surface of holes c. it cannot remove common eroors left by boring d. it can remove grinding marks left by grinding

it cannot remove common errors left by boring

polywood is one of the composite materials. it belongs to what type? a. fiber b. particle c. laminar d. flake e. filled f. none of the above

laminar

Generally speaking, the --- the rake angle, the sharper the cutting edge 1. larger 2. smaller

larger

comparing to traditional machining processes, thermal cutting processes will generate --- accurate tolerances. a. more b. less

less

in orthogonal cutting, cutting speed has ---- significant effects on cutting force than depth of cut a. more b. less

less

Generally, the ---the roughness value, the smoother the surface a. higher b. lower

lower

composite materials have --- density than aluminum a.lower b. higher

lower

for the thermoset, the melting temp is --- than curing temp a. higher b. lower

lower

generally, grinding processes produce --- surface roughness value than drilling processes a. higher b. lower

lower

the strength of a soldered joint is --- than that of a brazed joint a. higher b. lower c. about the same as

lower

Whether the chip is continuous or discontinuous is determined by several factors. Which has the least effects on the chip type? a. machine tool horsepower b. workpiece material c. cutting speed d. tool rake angle e. whether the cutting tool is in continuous contact with workpiece

machine tool horsepower

in fusion welding, fill metals --- used a. will always be b. will never be c. may or may not be used

may or may not be used

most semiconductor processes occur in the top few --- of a silicon wafer a. nanometers b. microns c. hundreds of microns

microns

twitst drilling is a kind of ---. a. single-point machining b. multi-point machining c. abrasive machining

multi-point machining

Chemical etching is _______ for the removal of residual surface damage caused by lapping. a. necessary b. unnecessary

necessary

flank wear occurs on a. the tool face that interacts with the newly-generated chip b. the tool face that interacts with the newly-generated surface of workpiece

newly-generated srface of workpiece

diamond grinding wheels are used to grind the cutting tools. is it appropriate to use diamond grinding wheels to grind the cutting tools of steels? a. yes b. no

no

Which one of the following is NOT among the benefits of cold working? a.Better surface finish is obtained. B. Superior dimensional control is achieved. C. Strength, fatigue and wear properties are improved through strain hardening. D. No residual stress is produced

no residual stress is produced

the desired qualities for an ideal tool material are: harder than workpiece; retain hardness at high templ resist wear and thermal shock; impact resistant; chemically inert. Which one of the following tool materials incorportaes these qualities? a. diamond b. ceramics c. HSS d. none

none

generally speaking, which process generates more hAZ? a. oxygen fuel cutting b.PAC plasma arc cutting c. AWM abrasive waterjet machining

oxygen fuel cutting

among the following three back end IC maunfacturing processes, which one is the last step? a. wafer sort testing b. final assembly c. packaging

packaging

accoriding to the continuous-cooling-transformation diagram, very slow cooling rate will obtain ---. a. martensite b. baiite c. pearlite d. ledeburite

pearlite

rivet holes are punched a. piercing b. blanking

piercing

which one of the matrices are most commonly used in industry? a. polymer b. metal c. ceramic d. carbon

polymer

which one of the molding processes appears int he video of how it's made : hunting bows? a.vacuum bag molding b. pressure-bag molding c pultrusion d. manual lay-up e. injection molding

pressure bag- molding

what will determine the diameter of the ingot during crystal growth? a. temp b. pull rate c. rotatting speed of the seed

pull rate

the movie shows manufacturing of the grinding wheels. in these wheels, what bond materials are used? a. resin b. vitrified c. metal

resin

normally the products of ---- can only be obtained in standard shapes and sizes a. rolling b. extrusion c. forging

rolling

in EDM, the onger the on-time,the --- the surface generated a. rougher b. finer

rougher

there are two different packaging levels for electronic ocmponents. the first level packaging is the chip assebly and packaging. in the second level packaging, the IC component is assembled onto a PCB the gigure aboe shows a typical product after which level of packaging? a. first level b. second levle

second level

generally speaking, grinding can --- the grinding wheel a. sharpen b. dull

sharpen

resistance welding is primarily used for welding--- a. sheet metals b. round metals

sheet metals

Which one of the following is NOT a consequences of tool wear? a. increases required power b. loss of production during tool changes c. tolerance control is lost d. shinny and nice surface finish on the product

shinny and nice surface finish on the product

between the two abrasive materials (aluminum oxide and silicon carbide) which one is inferior for grinding steels, becasue of its chemical reactivity with the steels? a. aluminum oxide b. silicon carbide

silicon carbide

Boring is a kind of a. single-point machining b. multi-point machining c. abrasive machining

single-point machining

in slab milling, the surface is generated by teeth located on the periphery a. slab b. face c. end

slab

if you want a larger ingot diameter, which pull rate should be used? a. faster b. slowe

slower

In creep feed grinding, the work feed is much ________ than that in conventional surface grinding. a. smaller b. larger

smaller

the abrasive particles used in polishing process is --- than those used in lapping? a. smaller b. larger

smaller

In lapping processes, the material of the lap is always _____ than the material to be finished. a. harder b. softer

softer

--- is used to mount IC components on printed circuit boards a. soldering b. brazing c. welding

soldering

friction welding is in the group of --- a. fusion welding b. solid-state welding

solid-state welding

X, Y, Z a. emitter, base, collector b. ampde. grid, cathode c. source, drain, gate d. source, gate, drain

source, gate, drain

most products are not made as a single piece. instead, they consist of more than two parts joined together. which one of the following is NOT amond the reasons for doing so? a. it is more economical or easier to manufacture this way b. for maintenacne and repaire c. different parts can have different properties d. for ease of transportation e. the joined product is typically stronger than a single piece

the joined product is typically stronger than a single piece

in regard to EDM and wire EDM, which one of the following is TRUE? a. the workpiece material does not have to be electrically conductive b. the melting point, hardness, toughness, or brittleness of the workpiece material will impose no limitations c. there is no wear of the tool during actual cutting d. the forces between the tool and the workpiece are not vitually zero

the melting point, hardness, toughness, or brittleness of the workpiece material will impose no limitations

in the equation to calculate the cutting speed in milling, v=pi*DN, D is the diameter of --- a. the workpiece b. the hole being machined c the tool

the tool

crater wear occurs on ---- a. the tool face that interacts with the newly-generated chip b. the tool face that interacts with the newly-generated surface of workpiece

the tool face that interacts with the newly-generated chip

EDM electrical discharge machining has several benefits. which one of the following is NOT? a. no cutting forces b. burr-free edges c. intricate details can be cut d. the tool never wears

the tool never wears

which kind of matrix can be reused? a. thermoset b. thermoplastic

thermoplastic

plastic injection molding processes are used mainly for --- a. thermosets b. thermoplastics

thermoplastics

which plastic materials are more suitable for making handles on cooking wares (pots and pans)? a. thermoplastics b. thermosets

thermosets

Most cutting processes are 1. three dimensional 2. orthogonal cutting

three d

what is the primary purpose of kanban systems? A.To control inventory. B. To reduce cycle time. C. To reduce setup time. D. To implement singe piece flow. E. To reduce variations in the products. .

to control inventory

an ideal cutting fluid has many benefits. Which one of te following is NOT one? a. to increase tool life b. to create no or less rust on machine tool c. to create no o less pollution to encironment d. to increase the yiedl strength of workpiece material

to increase the yiedl streength of workpiece material

which one of the following is NOT true regarding deformation processes? a. all processing is done in the solid state b. the forces required are often high c. machinery and tooling can be quite expensive d. unwanted regions are cut away so the amount of waste is large

unwanted regions are cut away so the amount of waste is large

the surface roughness and accuracy produced by grinding is generally ---- that produced by turning or milling a. up to 10 times better than b.worse than c. about the same as

up to 10 times better than

the movie shows manufacturing of airplanes. in making these airplanes, the processes are a. very labor-intensive b. highly automated

very labor-intensive

there are three major bond systems for grinding wheels: vitrified, organic, and metal. Which of the following associations are true? a. vitrified-glass, organic-resin b. organic-glass, vitrified-resin

vitrified glass, organic-resin

IC fabrication involves five gerneral stages. crystal growing is in the stage of --- a. wafer preparation b. wafer fabrication c. wafer test/sort d. assembly and packaging e. final test

wafer fabrication

in AWM, consumables --- be used a. will b. will NOT

will

in brazing and soldering, filler metals --- used. a. will always be b. will never be c. may or may not be

will always be used

riveting is used when-- a. the joined parts will not be sparated apart in the future b. the joined parts will be separated int he future

will not be separated

in solid state welding, the tem at the welding interface -- the melting point of the workpiece materials a. will not exceed b. will exceed

will not exceed

between wirepsawing and ID sawing, which one yieldsm ore wafers per unit lengthof crystal ingot a. wire sawing b. ID sawing

wire sawing

Will honing operations after drilling improve the surface quality? a. yes b. no

yes

diamond grinding wheels are used to grind the cutting tools. is it appropriate to use diamond grinding wheels to grind the cutting tools of tungsten carbides? a. yes b. no

yes

is the welding process used int he maufacturing of airplanes? a. yes b. no

yes

milling operations are used to machine flutes (or groves) in the blanks of the cutting tools. Is it appropriate to use milling to machine the flute for the cutting tools made of steels? a. yes b. no

yes

one part was made by a casting process. it was found that the hardness of this part was not high enough during service. can we improve the part's hardness by using (cold) forming processes instead of casting? a. yes b. no

yes

will increasing the drill rotational speed improve surface quality? a. yes b. no

yes

will using a reaming operation after drilling improve the surface quality? a. yes b. no

yes


Conjuntos de estudio relacionados

La Guerra Civil, El Alcazar, Guernica

View Set

Chapter 8: Underwriting and Financing Residential Properties

View Set

CompTIA A+ Practice Test (220-902)

View Set

Leadership Chapter 1 - Leadership and Management Principles

View Set