Grounding and Bonding Terms and Conditions

Grounding electrode (GE)

A conducting object though which a connection to earth is established.

Grounding Electrode Conductor (GEC)

A conductor used to connect the system grounded conductor or the equipment to a grounding electrode or to a point on the grounding electrode system.

Bonding Jumper (BJ)

A reliable conductor to ensure the required electrical conductivity between metal parts required to be electrically connected.

Grounded Conductor (GC)

A system or circuit conductor that is intentionally grounded.

Ungrounded Conductor (UC)

Phase or "hot" conductor

Equipment Grounding Conductor (EGC)

The conductive path(s) that provides a ground-fault current path and connects normally non-current-carrying metal parts of equipment together and to the system grounded conductor or to the grounding electrode conductor , or both and is located after an OCPD.

Supply Side Bonding Jumper (SSBJ)

The conductive path(s) that provides a ground-fault current path and connects normally non-current-carrying metal parts of the equipment together and to the system grounded conductor or to the grounding electrode conductor, or both and is located before an OCPD.

Main Bonding Jumper (MBJ)

The connection between the grounded circuit conductor and the equipment grounding conductor at the service.

System Bonding Jumper (SBJ)

The connection between the grounded circuit conductor and the supply-side bonded jumper, or the equipment grounding conductor, or both, at a separately derived system.

Equipment Bonding Jumper (EBJ)

The connection between two or more portions of the equipment grounding conductor.